Power
Q: What is the importance of
integrated-circuit power reduction?
A:
High-power density is a
serious problem in nanoelectronics design. According to
the International
Technology Roadmap for Semiconductors (ITRS), “power
consumption is now one of the major constraints in chip
design and the ITRS has identified it as one of the top
three overall challenges for the last 5 years.” Circuit
heat generation is the main limiting factor for scaling
of circuit speed and clocked-circuit density. For a
given CMOS technology, device speed is reduced at high
temperature and clocked-circuit density increases the
heat flux. Therefore, high-performance complex VLSI
systems are bounded by power density since either speed
or clocked-circuit density can be increased on a chip,
but generally not both..
Battery-powered applications can enjoy
additional power reduction benefits. Products employing
reduced power techniques can dramatically extend battery
life to provide competitive product advantage.
Reduced power in all applications
helps reduce energy consumption affording lower energy
costs and helps reduce environmental entropy impacts.
Q: How can
InnovaClockControlTM help reduce power consumption in integrated circuits?
A: Clocked-circuit power is a
significant and often dominant power consumer in modern
integrated circuits.
InnovaClockControlTM is designed to reduce power in the active circuitry –
whereas contemporary power reduction techniques work by
shutting down inactive circuitry (e.g. clock gating and
power gating). InnovaClockControlTM technology offers several power-reducing
benefits.
First, by judiciously scheduling tasks in a synchronous system, transient current (di/dt) and
RMS current (causing power-bus heating) can be reduced. RMS current reduction can reduce power-bus resistive losses 50%.
Second, reduced peak current will minimize the power-grid dynamic voltage drop – thereby enabling lower
chip operating voltage. Conceptual simulations of reduced drop and reduced chip operating voltage
indicated a 19% power reduction by this means alone.
Power Bus Integrity (Noise)
Q: What is power-bus integrity?
A: Power-bus integrity is the ability
of the integrated circuit, via its power-distribution
network, to deliver constant voltage at any necessary
current to the operating circuits. The power
distribution network is comprised of power (or multiple
power) and ground (or multiple ground) busses, typically
comprising a multi-layer metal grid across the
integrated circuit. The power grid is challenged to
deliver constant (or clean) voltage by the VLSI or SoC
high average current causing large ohmic IR voltage
drops, and fast current transients that cause large
inductive Ldi/dt voltage drops.
Q: Why is power-bus integrity
important?
A: Power-bus integrity is important
for a number of reasons. First, CMOS transistors used in
industry operate slower with reduced voltage. During
VLSI or SoC operation, high average
current and fast current transients cause power-bus
“compression” – power-bus VDD drops while ground-bus
voltage rises, reducing the voltage across the
logic-gate CMOS transistors. Power-bus compression can
therefore cause timing and logic errors. Performance and
function of the CMOS circuit can be severely
compromised.
Second, power-bus integrity ensures
that noise margins of CMOS logic are sufficient across
the integrated circuit. High average current and fast
current transients in the ground grid cause differences
in ground potential, reducing noise margin and
potentially causing performance failures in these CMOS
circuits.
Third, power-bus noise from digital
logic can contaminate precision analog circuit functions
such as communications blocks, PLLs, ADCs and DACs.
Forth, power-bus noise can radiate
from the chip as an Electromagnetic Interference (EMI),
causing interference to adjacent circuits and/or
jeopardizing regulatory emissions standards.
Q: What technological trends are
impacting the power integrity?
A: Both average current and transient
current are increasing at alarming rates. The average
current consumption in modern processors exceed 150 A,
and future processors will have increased current
requirements with continued process scaling. At
presents rates, processors will consume over 600 A by
2015! Additionally, transient current in modern
processors is about one tera-amp per second, the rate of
increase in transient current is expected to at least
double the rate of average current increase due to
increasing clock frequency, as calculated by the
International Technology Roadmap for Semiconductors (ITRS).
By 215 the expectation is 100 tera-amps per second!
Very little power bus parasitic inductance will incur
enormous transient voltage drop in both power and ground
busses.
Q: What peak-current reduction is
achievable and why is this important?
A: 45 nm technology-mapped ISCAS’89
models have shown 38% to 45% peak current reduction.
Peak current reduction directly reduces the peak
power-bus drop due to the power-bus (parasitic)
resistance. Peak current (IPK) draw by CMOS
circuits incurs voltage drop in both power and ground
power busses due to IPK*RBUSS,
where RBUSS is bus resistance.
Q: What rms current reduction is
achievable and why is this important?
A: Conceptual simulations have shown a
readily obtainable 31% rms current reduction. This rms
current reduction reduces power bus heating and
power-bus power loss by 50%.
Q: What transient current reduction is
achievable and why is this important?
A: Conceptual simulations have shown a
readily obtainable 75% transient current, di/dt,
reduction. High transient current is very problematic
in power busses because power-bus parasitic inductance
multiplied by the change in current (transient current,
di/dt) begets power-bus voltage drop that starves CMOS
logic circuits from their needed operating voltage.
The end results are numerous, including timing and logic
errors.
Technology Description
Q: Briefly, what is
InnovaClockControlTM?
A:
InnovaClockControlTM is an RTL-level
method that schedules circuit activities at optimal
intervals within the unaltered clock period. When
switching activities are redistributed more evenly
across the clock period, IC supply-current consumption
is also spread across a wider range of time within the
clock period. This has the beneficial effect of reducing
peak-current draw in addition to reducing rms power draw
without having to change the operating frequency and
without utilizing additional power supply voltages (as
in dual or multi VT approaches). In fact,
InnovaClockControlTM is complementary and
can be utilized in conjunction with most power-reduction
methods such as clock gating, multi- VT,
power switching/power shut-off; back-end process such as
floor-plan and interconnect optimizations,
and leakage-power reduction
methods.
Q: What is the Technology Readiness
Level (TRL) of
InnovaClockControlTM?
A:
InnovaClockControlTM
is presently at TRL3. The technology behind
InnovaClockControlTM has
been proven in conceptual and benchmark simulations,
such as ISCAS’89 models technology mapped to 45 nm.
Commercial tool flow is in development targeting the ARM
series processor as a first demonstration by 2Q10. We
are seeking the appropriate industry partner for initial
commercial integration beginning 3Q10.
Q: Does
InnovaClockControlTM require
any on-chip or external power supply or external
components?
A: No.
Q: Does
InnovaClockControlTM
require special fabrication process?
A: No.
Q: Does
InnovaClockControlTM
afford integrated-circuit chip or package cost
reductions?
A: Yes. The peak current reduction
can reduce the need for on-chip decaps, package
decoupling capacitors, and on-board decoupling
capacitors. Reduced heat dissipation can reduce package
type and cost significantly.
Q: Can
InnovaClockControlTM
be verified with existing timing and functional
simulation tools?
A: Yes.
InnovaClockControlTM
is consistent with existing RTL design constructs and
integrates with existing tool-flows with minimal impact.
Performance
Q: Will the clock rate be adversely
impacted using
InnovaClockControlTM
?
A: The clock rate will not be
decreased. In fact, with improved power-grid integrity
(reduced VDD drop and reduced ground bounce) CMOS
transistors operate faster – the clock rate could be
increased slightly.
Q: What are the complexity, area and
power overhead impacts of incorporating
InnovaClockControlTM
?
A:
InnovaClockControlTM
hardware is relatively low complexity. Circuit
complexity is minimized by the use of special algorithms
in the design optimization tool-flow.
Power
overhead is dependent upon the integrated-circuit
design. As an example,
InnovaClockControlTM
circuit was analyzed for power consumption on ISCAS’85
circuit c432 -- the power overhead is only 3.2%.
Area analysis of ten ISCAS’85
benchmark circuits technology-mapped to 45 nm, yielded a
minimum area overhead 0.33 %, average area overhead
1.22 %, and maximum area overhead 2.73 %.
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